2026-10-19T01:57:03Zhttps://ebyu-rdlopen.rawdatalibrary.net/oai/requestoai:ebyu-rdlopen.rawdatalibrary.net:ebyu/159882026-10-18T21:14:28Zopenairedrivercom_ebyu_10000col_ebyu_10001Experimental study on active cooling systems used for thermal management of high-power multichip light-emitting diodesKaya, MehmetAlgorithmsEquipment DesignHot TemperatureLightingModels, TheoreticalSemiconductorsArticlecoolingelectrical equipmentheatheat pipe cooling devicehigh power multichip light emitting diodeinvestigative procedureslight emitting diodetemperaturethermoelectric cooleralgorithmdevicesilluminationsemiconductortheoretical modelThe objective of this study was to develop suitable cooling systems for high-power multichip LEDs. To this end, three different active cooling systems were investigated to control the heat generated by the powering of high-power multichip LEDs in two different configurations (30 and 2 × 15 W). The following cooling systems were used in the study: an integrated multi-fin heat sink design with a fan, a cooling system with a thermoelectric cooler (TEC), and a heat pipe cooling device. According to the results, all three systems were observed to be sufficient for cooling high-power LEDs. Furthermore, it was observed that the integrated multifin heat sink design with a fan was the most efficient cooling system for a 30 W high-power multichip LED. The cooling system with a TEC and 46 W input power was the most efficient cooling system for 2 × 15 W high-power multichip LEDs. © 2014 Mehmet Kaya.Hindawi Publishing Corporation2014Articlehttps://rdlopen.rawdatalibrary.net/r/ebyu/15988https://doi.org/10.1155/2014/5638052356-6140enScientific World Journalinfo:eu-repo/semantics/openAccessinfo:eu-repo/semantics/articlehttps://ebyu-rdlopen.rawdatalibrary.net/tr/items/ebyu/15988