<?xml version="1.0" encoding="UTF-8"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-10-19T01:05:37Z</responseDate><request verb="GetRecord" identifier="oai:ebyu-rdlopen.rawdatalibrary.net:ebyu/16167" metadataPrefix="oai_dc">https://ebyu-rdlopen.rawdatalibrary.net/oai/request</request><GetRecord><record><header><identifier>oai:ebyu-rdlopen.rawdatalibrary.net:ebyu/16167</identifier><datestamp>2026-10-18T20:30:58Z</datestamp><setSpec>openaire</setSpec><setSpec>driver</setSpec><setSpec>com_ebyu_10000</setSpec><setSpec>col_ebyu_10001</setSpec></header><metadata><oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><dc:title>The electrical characteristics of Cu/CuS/p-Si/Al structure</dc:title><dc:creator>Ateş, A.</dc:creator><dc:creator>Saǧlam, M.</dc:creator><dc:creator>Güzeldir, B.</dc:creator><dc:creator>Yildirim, M.A.</dc:creator><dc:creator>Astam, A.</dc:creator><dc:subject>Coatings</dc:subject><dc:subject>Electrical properties</dc:subject><dc:subject>Interfaces</dc:subject><dc:subject>Multilayer</dc:subject><dc:subject>Thin films</dc:subject><dc:subject>Aluminum compounds</dc:subject><dc:subject>Bias voltage</dc:subject><dc:subject>Electric properties</dc:subject><dc:subject>Electric resistance</dc:subject><dc:subject>Film preparation</dc:subject><dc:subject>Interface states</dc:subject><dc:subject>Interfaces (materials)</dc:subject><dc:subject>Multilayer films</dc:subject><dc:subject>Multilayers</dc:subject><dc:subject>Silicon</dc:subject><dc:subject>Silicon compounds</dc:subject><dc:subject>Current voltage curve</dc:subject><dc:subject>Density distributions</dc:subject><dc:subject>Electrical characteristic</dc:subject><dc:subject>High current densities</dc:subject><dc:subject>Multi-layer devices</dc:subject><dc:subject>Rectifying behaviors</dc:subject><dc:subject>Series resistance effects</dc:subject><dc:subject>Successive ionic layer adsorption and reactions</dc:subject><dc:subject>Copper compounds</dc:subject><dc:description>Cu/CuS/p-Si/Al structure formed using CuS thin film on p-Si substrate. CuS thin film has been grown with using Successive Ionic Layer Adsorption and Reaction (SILAR) method. The Cu/CuS/p-Si/Al structure has demonstrated clearly rectifying behavior by the current-voltage (I-V) curves studied at room temperature. The characteristic parameters such as barrier height, ideality factor and series resistance of Cu/CuS/p-Si/Al structure have been calculated from the forward bias I-V and reverse bias C-2-V characteristics. The ideality factor and barrier height have been obtained as n=1.63 and Φb=0.69 eV by applying a thermo-ionic emission theory. At high current densities in the forward direction, the series resistance effect has been observed. The values of Rs obtained from dV/d(lnI) - I and H(I) - I plots are near to each others (Rs=340.33 □ and R s=346.24 □, respectively). In the same way, the barrier height calculated from C-2-V characteristics have been varied from 0.523 to 0.601 eV. Furthermore, the density distribution of interface states of the multilayer device has been obtained from the semi-log forward bias I-V characteristics. It has been seen that the Nss has almost an exponential rise with bias voltage from top of the valance band toward to mid gap.</dc:description><dc:publisher>National Institute of Optoelectronics</dc:publisher><dc:date>2010</dc:date><dc:type>Article</dc:type><dc:identifier>https://rdlopen.rawdatalibrary.net/r/ebyu/16167</dc:identifier><dc:identifier>1454-4164</dc:identifier><dc:language>en</dc:language><dc:relation>Journal of Optoelectronics and Advanced Materials</dc:relation><dc:rights>info:eu-repo/semantics/openAccess</dc:rights><dc:type>info:eu-repo/semantics/article</dc:type><dc:identifier>https://ebyu-rdlopen.rawdatalibrary.net/tr/items/ebyu/16167</dc:identifier></oai_dc:dc></metadata></record></GetRecord></OAI-PMH>