The comparison of Co/hematoxylin/n-Si and Co/hematoxylin/p-Si devices as rectifier for a wide range temperature

ArticleAçık Erişim

Özet

We employed hematoxylin as interfacial layer between the n- and p-type silicon substrate and cobalt (Co) metallic contact to obtain and compare Co/hematoxylin/n-Si and Co/hematoxylin/p-Si devices for a wide range temperature via current-voltage (I–V) characteristics. Furthermore, we studied structural and morphological properties of the hematoxylin thin film by x-ray diffractometer (XRD) and scanning electron microscope (SEM). The temperature range was changed from 100 K to 460 K via 20 K interval for I–V measurements. The Co/hematoxylin/n-Si and Co/hematoxylin/p-Si devices exhibited excellent rectifying behaviors for low temperatures, but rectifying ratio (RR) values decreased with increasing temperature at ±1 V bias. In addition, the devices showed thermal sensor or detector behavior because current values increased with increasing temperature at reverse biases. The Co/hematoxylin/p-Si device has better stability than Co/hematoxylin/n-Si device at reverse biases for the same temperature values according to stop leakage current with increasing voltage. In addition, the diode parameters such as barrier height, ideality factor and series resistance as well as interface states density were extracted from the I–V measurements and compared in details for various techniques such as thermionic emission theory, Norde and Cheung methods. The diode parameters of the both devices were affected from the temperature changes. The Co/hematoxylin/n-Si and Co/hematoxylin/p-Si devices are good candidate for rectifying and thermal sensing applications. © 2020 Elsevier Ltd

Anahtar Kelimeler

RDL Kalıcı Bağlantı (PID)
https://rdlopen.rawdatalibrary.net/r/ebyu/13531Resmi atıflarda kullanılan kalıcı adres
DOI
https://doi.org/10.1016/j.mssp.2020.105039Yayıncı resmi DOI adresi
Tam Kayıt
AlanDeğerDil
dc.contributor.authorYilmaz, Mehmet
dc.contributor.authorKocyigit, Adem
dc.contributor.authorCirak, Burcu Bozkurt
dc.contributor.authorKacus, Hatice
dc.contributor.authorIncekara, Umit
dc.contributor.authorAydogan, Sakir
dc.date.accessioned2026-10-18T20:28:21.886816158Z
dc.date.available2026-10-18T20:28:21.886816158Z
dc.date.issued2020
dc.description.abstractWe employed hematoxylin as interfacial layer between the n- and p-type silicon substrate and cobalt (Co) metallic contact to obtain and compare Co/hematoxylin/n-Si and Co/hematoxylin/p-Si devices for a wide range temperature via current-voltage (I–V) characteristics. Furthermore, we studied structural and morphological properties of the hematoxylin thin film by x-ray diffractometer (XRD) and scanning electron microscope (SEM). The temperature range was changed from 100 K to 460 K via 20 K interval for I–V measurements. The Co/hematoxylin/n-Si and Co/hematoxylin/p-Si devices exhibited excellent rectifying behaviors for low temperatures, but rectifying ratio (RR) values decreased with increasing temperature at ±1 V bias. In addition, the devices showed thermal sensor or detector behavior because current values increased with increasing temperature at reverse biases. The Co/hematoxylin/p-Si device has better stability than Co/hematoxylin/n-Si device at reverse biases for the same temperature values according to stop leakage current with increasing voltage. In addition, the diode parameters such as barrier height, ideality factor and series resistance as well as interface states density were extracted from the I–V measurements and compared in details for various techniques such as thermionic emission theory, Norde and Cheung methods. The diode parameters of the both devices were affected from the temperature changes. The Co/hematoxylin/n-Si and Co/hematoxylin/p-Si devices are good candidate for rectifying and thermal sensing applications. © 2020 Elsevier Ltd
dc.identifier.doi10.1016/j.mssp.2020.105039
dc.identifier.eissn1873-4081
dc.identifier.issn1369-8001
dc.identifier.scopus2-s2.0-85081010020
dc.identifier.startpage105039
dc.identifier.urihttps://rdlopen.rawdatalibrary.net/r/ebyu/13531
dc.identifier.volume113
dc.identifier.wosWOS:000523559300009
dc.language.isoen
dc.publisherElsevier Ltd
dc.relation.ispartofMaterials Science in Semiconductor Processing
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectCo/hematoxylin/n-Si
dc.subjectCo/hematoxylin/p-Si
dc.subjectHematoxylin thin films
dc.subjectTemperature-dependent I–V characteristics
dc.subjectElectric resistance
dc.subjectInterface states
dc.subjectRectifying circuits
dc.subjectScanning electron microscopy
dc.subjectTemperature
dc.subjectThermionic emission
dc.subjectThin films
dc.subjectIncreasing temperatures
dc.subjectRectifying behaviors
dc.subjectSeries resistances
dc.subjectStructural and morphological properties
dc.subjectTemperature changes
dc.subjectTemperature dependent
dc.subjectThermionic emission theory
dc.subjectX ray diffractometers
dc.subjectSilicon
dc.titleThe comparison of Co/hematoxylin/n-Si and Co/hematoxylin/p-Si devices as rectifier for a wide range temperature
dc.typeArticle
dspace.entity.typePublication
rdl.citation.scopus37
rdl.citation.wos37
rdl.source.indexSCOPUS
rdl.source.indexWOS
rdl.wos.indexScience Citation Index Expanded (SCI-EXPANDED)