Experimental study on active cooling systems used for thermal management of high-power multichip light-emitting diodes

ArticleAçık Erişim

Özet

The objective of this study was to develop suitable cooling systems for high-power multichip LEDs. To this end, three different active cooling systems were investigated to control the heat generated by the powering of high-power multichip LEDs in two different configurations (30 and 2 × 15 W). The following cooling systems were used in the study: an integrated multi-fin heat sink design with a fan, a cooling system with a thermoelectric cooler (TEC), and a heat pipe cooling device. According to the results, all three systems were observed to be sufficient for cooling high-power LEDs. Furthermore, it was observed that the integrated multifin heat sink design with a fan was the most efficient cooling system for a 30 W high-power multichip LED. The cooling system with a TEC and 46 W input power was the most efficient cooling system for 2 × 15 W high-power multichip LEDs. © 2014 Mehmet Kaya.

Anahtar Kelimeler

RDL Kalıcı Bağlantı (PID)
https://rdlopen.rawdatalibrary.net/r/ebyu/15988Resmi atıflarda kullanılan kalıcı adres
DOI
https://doi.org/10.1155/2014/563805Yayıncı resmi DOI adresi
Tam Kayıt
AlanDeğerDil
dc.contributor.authorKaya, Mehmet
dc.date.accessioned2026-10-18T20:30:49.961642166Z
dc.date.available2026-10-18T20:30:49.961642166Z
dc.date.issued2014
dc.description.abstractThe objective of this study was to develop suitable cooling systems for high-power multichip LEDs. To this end, three different active cooling systems were investigated to control the heat generated by the powering of high-power multichip LEDs in two different configurations (30 and 2 × 15 W). The following cooling systems were used in the study: an integrated multi-fin heat sink design with a fan, a cooling system with a thermoelectric cooler (TEC), and a heat pipe cooling device. According to the results, all three systems were observed to be sufficient for cooling high-power LEDs. Furthermore, it was observed that the integrated multifin heat sink design with a fan was the most efficient cooling system for a 30 W high-power multichip LED. The cooling system with a TEC and 46 W input power was the most efficient cooling system for 2 × 15 W high-power multichip LEDs. © 2014 Mehmet Kaya.
dc.identifier.doi10.1155/2014/563805
dc.identifier.issn2356-6140
dc.identifier.pmcidPMC4139020
dc.identifier.pmid25162058
dc.identifier.scopus2-s2.0-84929054401
dc.identifier.startpage563805
dc.identifier.urihttps://rdlopen.rawdatalibrary.net/r/ebyu/15988
dc.identifier.volume2014
dc.identifier.wosWOS:000343478700001
dc.language.isoen
dc.publisherHindawi Publishing Corporation
dc.relation.ispartofScientific World Journal
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectAlgorithms
dc.subjectEquipment Design
dc.subjectHot Temperature
dc.subjectLighting
dc.subjectModels, Theoretical
dc.subjectSemiconductors
dc.subjectArticle
dc.subjectcooling
dc.subjectelectrical equipment
dc.subjectheat
dc.subjectheat pipe cooling device
dc.subjecthigh power multichip light emitting diode
dc.subjectinvestigative procedures
dc.subjectlight emitting diode
dc.subjecttemperature
dc.subjectthermoelectric cooler
dc.subjectalgorithm
dc.subjectdevices
dc.subjectillumination
dc.subjectsemiconductor
dc.subjecttheoretical model
dc.titleExperimental study on active cooling systems used for thermal management of high-power multichip light-emitting diodes
dc.typeArticle
dspace.entity.typePublication
rdl.citation.scopus16
rdl.citation.wos15
rdl.departmentDepartment of Mechanical Engineering, Erzincan University, 24100 Erzincan, Turkey.
rdl.oa.statusgold
rdl.source.indexSCOPUS
rdl.source.indexWOS
rdl.source.indexPUBMED
rdl.wos.indexScience Citation Index Expanded (SCI-EXPANDED)