Multi-objective optimization of a liquid metal cooled heat sink for electronic cooling applications

ArticleAçık Erişim

Özet

Recently, studies on the use of MCHS applied to chips to benefit from the high thermal conductivity of liquid metals have been increasing. This study came up with an optimum choice for MCHS geometric parameters, MCHS material, Gallium-based liquid metal coolant type, and coolant inlet velocity. Total thermal resistance (Rtot), initial investment cost (Ci), pressure drop (ΔP), and maximum operating temperature (Tmax) are selected as performance parameters. I-optimality algorithm used for generation of the Design of Experiment (DoE) based on the Response Surface Method. The optimization parameters and their levels are determined by performing a parametric study. The derived mathematical models for selected performance parameters Rtot, Ci, Tmax, and ΔP, which are also objective functions, are tested by ANOVA with prediction accuracy of 0.983%, 0.997%, 0.886%, and 0.996%, respectively. As a result, the determined optimum values of the channel width, channel height, half of fin width, fin slope angle, and inlet velocity, are 1.16 mm, 3.00 mm, 0.24 mm, 5.96°, and 0.4 m s−1, respectively. In addition, a hybrid structure in which the base of the designed MCHS is aluminum, and the fins are copper, and the GaIn compound for the coolant are calculated as the optimum material options. © 2023

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RDL Kalıcı Bağlantı (PID)
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AlanDeğerDil
dc.contributor.authorKalkan, Orhan
dc.date.accessioned2026-10-18T20:27:23.135550266Z
dc.date.available2026-10-18T20:27:23.135550266Z
dc.date.issued2023
dc.description.abstractRecently, studies on the use of MCHS applied to chips to benefit from the high thermal conductivity of liquid metals have been increasing. This study came up with an optimum choice for MCHS geometric parameters, MCHS material, Gallium-based liquid metal coolant type, and coolant inlet velocity. Total thermal resistance (Rtot), initial investment cost (Ci), pressure drop (ΔP), and maximum operating temperature (Tmax) are selected as performance parameters. I-optimality algorithm used for generation of the Design of Experiment (DoE) based on the Response Surface Method. The optimization parameters and their levels are determined by performing a parametric study. The derived mathematical models for selected performance parameters Rtot, Ci, Tmax, and ΔP, which are also objective functions, are tested by ANOVA with prediction accuracy of 0.983%, 0.997%, 0.886%, and 0.996%, respectively. As a result, the determined optimum values of the channel width, channel height, half of fin width, fin slope angle, and inlet velocity, are 1.16 mm, 3.00 mm, 0.24 mm, 5.96°, and 0.4 m s−1, respectively. In addition, a hybrid structure in which the base of the designed MCHS is aluminum, and the fins are copper, and the GaIn compound for the coolant are calculated as the optimum material options. © 2023
dc.identifier.doi10.1016/j.ijthermalsci.2023.108325
dc.identifier.eissn1778-4166
dc.identifier.issn1290-0729
dc.identifier.scopus2-s2.0-85151784213
dc.identifier.startpage108325
dc.identifier.urihttps://rdlopen.rawdatalibrary.net/r/ebyu/12488
dc.identifier.volume190
dc.identifier.wosWOS:000982189900001
dc.language.isoen
dc.publisherElsevier Masson s.r.l.
dc.relation.ispartofInternational Journal of Thermal Sciences
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectCooling
dc.subjectGallium
dc.subjectHeat sink
dc.subjectLiquid metal
dc.subjectOptimization
dc.subjectCoolants
dc.subjectCopper compounds
dc.subjectDesign of experiments
dc.subjectElectronic cooling
dc.subjectFins (heat exchange)
dc.subjectInlet flow
dc.subjectMultiobjective optimization
dc.subjectThermal conductivity
dc.subjectCooling applications
dc.subjectElectronics cooling
dc.subjectHigh thermal conductivity
dc.subjectInlet velocity
dc.subjectInvestment costs
dc.subjectLiquid metal coolants
dc.subjectMulti-objectives optimization
dc.subjectOperating temperature
dc.subjectOptimisations
dc.subjectPerformance parameters
dc.subjectLiquid metals
dc.titleMulti-objective optimization of a liquid metal cooled heat sink for electronic cooling applications
dc.typeArticle
dspace.entity.typePublication
rdl.citation.scopus23
rdl.citation.wos24
rdl.source.indexSCOPUS
rdl.source.indexWOS
rdl.wos.indexScience Citation Index Expanded (SCI-EXPANDED)