Fabrication and Characterization of NiSe2 Films Prepared by SILAR Method

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Özet

Nickel selenide thin films were grown on glass substrates at room temperature using the successive ionic layer adsorption and reaction (SILAR) method. Optical and structural analyses of the thin films were also performed. X-ray diffraction (XRD), energy dispersive x-ray analysis (EDAX) and scanning electron microscopy (SEM) were used for structural analysis, and UV–vis spectrometer was used for optical analysis. The XRD results indicate that the NiSe2 thin films had a polycrystalline structure. As a result of the optical analysis, the bandgap value decreased from 2.56 to 2.25 eV as the thickness increased. These results suggest that increasing film thickness improves the crystal structure of NiSe2 thin films. © 2023 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC. © 2023 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.

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RDL Kalıcı Bağlantı (PID)
https://rdlopen.rawdatalibrary.net/r/ebyu/12401Resmi atıflarda kullanılan kalıcı adres
DOI
https://doi.org/10.1002/tee.23862Yayıncı resmi DOI adresi
Tam Kayıt
AlanDeğerDil
dc.contributor.authorAkaltun, Yunus
dc.date.accessioned2026-10-18T20:27:18.465520160Z
dc.date.available2026-10-18T20:27:18.465520160Z
dc.date.issued2023
dc.description.abstractNickel selenide thin films were grown on glass substrates at room temperature using the successive ionic layer adsorption and reaction (SILAR) method. Optical and structural analyses of the thin films were also performed. X-ray diffraction (XRD), energy dispersive x-ray analysis (EDAX) and scanning electron microscopy (SEM) were used for structural analysis, and UV–vis spectrometer was used for optical analysis. The XRD results indicate that the NiSe2 thin films had a polycrystalline structure. As a result of the optical analysis, the bandgap value decreased from 2.56 to 2.25 eV as the thickness increased. These results suggest that increasing film thickness improves the crystal structure of NiSe2 thin films. © 2023 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC. © 2023 Institute of Electrical Engineer of Japan and Wiley Periodicals LLC.
dc.identifier.doi10.1002/tee.23862
dc.identifier.eissn1931-4981
dc.identifier.endpage1418
dc.identifier.issn1931-4973
dc.identifier.issue9
dc.identifier.scopus2-s2.0-85164479229
dc.identifier.startpage1414
dc.identifier.urihttps://rdlopen.rawdatalibrary.net/r/ebyu/12401
dc.identifier.volume18
dc.identifier.wosWOS:001024899500001
dc.language.isoen
dc.publisherJohn Wiley and Sons Inc
dc.relation.ispartofIEEJ Transactions on Electrical and Electronic Engineering
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectdeposition
dc.subjectNiSe<sub>2</sub>
dc.subjectSILAR
dc.subjectthicknesses
dc.subjectthin film
dc.subjectCrystal structure
dc.subjectEnergy dispersive X ray analysis
dc.subjectFilm thickness
dc.subjectGlass substrates
dc.subjectNickel compounds
dc.subjectScanning electron microscopy
dc.subjectSelenium compounds
dc.subjectStructural analysis
dc.subjectThin films
dc.subjectX ray diffraction analysis
dc.subjectAdsorption method
dc.subjectFabrication and characterizations
dc.subjectNickel selenide thin films
dc.subjectOptical analysis
dc.subjectReaction method
dc.subjectSuccessive ionic layer adsorption and reactions
dc.subjectThickness
dc.subjectThin-films
dc.subjectX- ray diffractions
dc.titleFabrication and Characterization of NiSe2 Films Prepared by SILAR Method
dc.typeArticle
dspace.entity.typePublication
rdl.citation.scopus10
rdl.citation.wos10
rdl.source.indexSCOPUS
rdl.source.indexWOS
rdl.wos.indexScience Citation Index Expanded (SCI-EXPANDED)